ULTRASONIC axialGRINDING

Grinding of rotationally symmetrical structures in hard-brittle materials with highest performance
Manufacturing of bearing rings, wafer chucks, microwave windows for many areas of the semiconductor industry, optics and technical ceramics
Use for various contours, also spheres

Highlights

Customer Benefits

Easy programming through intuitive operator masks
Selection of different cutting edges and angle of the grinding tool
Automatic adjustment of the tool contact point depending on the contour

Left : Different tool settings for changing the engagement point of the of the ULTRASONIC grinding tools. / Right : Simple setup of the grinding tools including edge radii.

Downloads

63 exclusive DMG MORI Technology Cycles (PDF-Download 23.7 MB)

Whitepaper Gear Cutting DMG MORI 2022 EN (PDF-Download 3.2 MB)

Technical data

Machines

ULTRASONIC Series

Controls

CELOS with SIEMENS

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● available